Onsemi has officially introduced the Embedded Power Platform (EPP), an innovative technology designed to revolutionize power electronics. By utilizing 12-inch silicon wafers as package substrates instead of traditional printed circuit boards, this architecture reshapes modern power management. For more insights into hardware developments, check out these optics articles to stay ahead of tech trends.
The system seamlessly integrates power semiconductors and control chips directly into a single wafer structure. This design successfully eliminates conventional power module assembly steps.
Advanced Integration and Thermal Benefits
By embedding diverse chips—including silicon, silicon carbide, and gallium nitride power semiconductors alongside drivers and controllers—the architecture achieves remarkable efficiency. Shorter physical connections between these integrated elements actively minimize power losses caused by current flow and voltage fluctuations during high-frequency switching. Readers interested in examining smaller hardware details can also look into specialized laboratory microscopes.
Optimized Heat Dissipation
The strategic deployment of silicon significantly enhances overall thermal conductivity within the package. This property leads to far superior heat dissipation compared to traditional mold compounds.
Better thermal management prevents dangerous overheating in high-load scenarios. It ensures stable operation under demanding continuous usage conditions.
Applications in Electric Vehicles and AI Data Centers
Key target applications for this advanced platform include traction inverters for electric vehicles and solid-state circuit breakers for artificial intelligence data centers. For electric vehicle traction inverters specifically, EPP can boost power density by up to four times while cutting power losses by 15%.
Because a single basic architecture scales easily across various power ratings, automakers can bypass developing separate inverters. This streamlined approach shortens overall vehicle development times by up to four months.
Industry Partnership and Future Outlook
Prominent Japanese automaker Subaru is participating as an early engineering partner to evaluate the platform’s viability for future electrified vehicles. This collaboration highlights the automotive sector’s growing interest in high-density integration.
Onsemi intends to begin shipping EPP engineering samples to key automotive and AI sector customers within the year. These early distributions will pave the way for commercial integration across next-generation technological infrastructure.
Here is the source article for this story: Onsemi to Eliminate Power Module Assembly by Integrating Chips Into Wafers
