Hanmi Semiconductor is aggressively expanding its post-process equipment business by leveraging proprietary semiconductor package cutting and inspection systems. This strategic push has allowed the company to double its sales velocity through innovative technology deployment.
The enterprise successfully localized the cutting equipment known as the micro SAW in 2021, effectively breaking its previous reliance on Japanese products. This technological breakthrough paved the way for rapidly increasing sales of its advanced micro saw & vision place (MSVP) equipment line.
The Rise of MSVP Equipment Systems
Cumulative sales for MSVP between January and August surpassed the total figures from the previous entire year. Annual sales are projected to double year-over-year, targeting over 200 units, and climb to roughly 350 units next year. Similar precision advancements can often be explored across optics articles detailing modern industrial engineering.
The MSVP system seamlessly integrates precise package cutting, cleaning, drying, inspection, and loading functions into a single process. It supports diverse production fields, including DRAM, NAND flash, high bandwidth memory (HBM), and printed circuit boards. Readers interested in related magnification tools can browse various microscopes used in quality control laboratories.
Market Drivers and Supply Chain Independence
Demand for these cutting and inspection tools has surged alongside the rising popularity of panel level packaging for large-scale AI semiconductors. Hanmi originally began developing its own cutting technology in 2019 to secure a stable supply chain amidst market booms and component shortages.
Building on its global competitiveness with HBM TC bonders and MSVP systems, Hanmi Semiconductor plans to open a U.S. corporate office to better serve local clients. This localized approach ensures optimized client support as global manufacturing demands continue to scale upward.
Here is the source article for this story: Back-End Powerhouse HANMI Semiconductor Sweeps Global Markets with Dicing and Inspection Equipment
