The global race to power next-generation artificial intelligence systems just took a leap forward. Paris-based deep-tech startup NcodiN secured an oversubscribed €16 million (US$18.4 million) seed round.
This company is shaking up AI hardware with its NConnect optical interposer technology. Their design aims to break through the old performance bottleneck of electrical interconnects—sometimes called the “copper wall”.
NcodiN says its breakthrough will push energy efficiency and scalability to new heights for future AI supercomputers. With this funding, they’re moving from lab innovation to large-scale industrial production.
Breaking the Copper Wall: The Promise of Photonic Interposers
AI systems keep getting more powerful, but traditional electrical connections inside chips just can’t keep up. Bandwidth limits, heat, and wasted energy are slowing things down.
This is where NcodiN’s NConnect comes into play. It’s a photonic interposer that moves data using light, not electricity, blasting data at high speeds with almost no energy loss.
The World’s Smallest Laser on Silicon
At the heart of NConnect sits what they call “the world’s smallest laser on silicon”. It’s about 500 times smaller than today’s industry-standard devices.
This tiny innovation sets new records for energy efficiency, hitting less than 0.1 pJ/bit. It allows ultra-dense integration—over 10,000 devices per square millimeter.
That kind of density is crucial for packing massive computational power into the next wave of AI architectures. It helps avoid hitting thermal or spatial limits.
A Plug-and-Play Optical Network for the AI Era
One of NcodiN’s standout features is its plug-and-play design. Unlike some technologies that force a complete processor redesign, NConnect fits right into today’s chiplet architectures and multi-processor systems.
This opens up possibilities for wafer-scale “superchips”—huge chip assemblies that can run complex AI workloads with impressive efficiency.
Enabling Energy-Efficient AI Superchips
CEO Francesco Manegatti points out that NcodiN’s low-energy interconnects are essential for scaling AI hardware. By connecting multiple chiplets into a unified platform, they cut energy use per data transfer and let AI systems process huge datasets more sustainably.
Strategic Investment and Global Support
The oversubscribed seed round shows investors have real confidence in NcodiN’s role in the AI hardware shift. MIG Capital (USA) led the round, with support from Maverick Silicon (USA), PhotonVentures (Netherlands), and Verve Ventures (Switzerland).
Seasoned European backers like Elaia, Earlybird, and OVNI also joined in.
Investor Confidence in AI Infrastructure
Oliver Kahl of MIG Capital highlighted NcodiN’s strategic spot in the fast-growing AI infrastructure market. With demand for high-performance, energy-efficient AI computation soaring, NcodiN’s photonic platform could become a core technology powering tomorrow’s intelligent systems.
From R&D to Full Industrial Scale
The new capital will help NcodiN shift from research to commercialization. They plan to:
- Set up a CMOS pilot line on 300-mm wafers
- Scale up engineering and supply chain operations
- Open a Silicon Valley office to boost their U.S. presence
- Grow the R&D team for ongoing innovation
- Prepare for large-scale manufacturing partnerships to speed up industrial adoption
Bridging the Lab and the Factory Floor
Making the jump from prototype to industrial product is a big deal for any deep-tech company. By building manufacturing capabilities and partnerships early, NcodiN puts itself in a strong position to meet the fast-rising demand for advanced AI interconnect solutions—without sacrificing quality or innovation.
Why NcodiN’s Breakthrough Matters
In AI hardware, interconnect technology often sets the limits. With photonic interposers that break records for efficiency and density, NcodiN is enabling AI architectures that are faster, more power-efficient, and a lot more scalable.
It’s not just a technical achievement—it’s a leap in how we design and deploy computational systems. If you care about the future of AI hardware, this is one to watch.
A Key Player in the AI Hardware Race
AI systems keep growing more complex and capable, and that means technologies like NConnect aren’t just nice-to-have anymore—they’re essential. NcodiN’s innovations could actually set the pace for the next wave of AI breakthroughs.
We’re talking about changes that might reshape everything from self-driving cars to how scientists make discoveries. With strong investor support and a straightforward plan for scaling up, NcodiN looks ready to shake up AI hardware performance.
That jump from copper to light? It could end up being one of those moments people look back on as a turning point in computing history.
Here is the source article for this story: NCodiN Closes €16 Million Seed Round