In the race to build faster, more reliable, and more integrated electronics and photonic systems, engineered low-loss glass substrates are making waves as a transformative material.
Their mix of electrical resistivity, optical transparency, and dimensional stability puts them in a strong position for next-generation radio frequency (RF) modules and co-packaged optics (CPO).
AI-driven workloads and ultra-high bandwidth are reshaping data center architectures. At this point, minimizing signal loss while improving optical and RF integration isn’t just nice to have—it’s absolutely essential.
The Rise of Engineered Glass in RF and Photonic Packaging
For years, traditional substrate materials like organic laminates have been the go-to for RF and photonics applications.
But as we move to higher frequencies such as the Ka-band and demand seamless optical coupling, these materials start to show their age and limitations.
Key Performance Advantages Over Conventional Materials
Engineered glass substrates come out ahead of organic laminates with smoother surfaces, lower dielectric loss tangents, and better dimensional stability.
These strengths lead to improved insertion loss, tighter impedance control, and stronger signal integrity in high-frequency designs.
- High resistivity: Cuts down parasitic signal degradation at higher frequencies.
- Low dielectric loss: Delivers cleaner RF signals for Ka-band performance.
- Optical transparency: Lets you integrate photonic pathways right alongside electronic circuits.
- Mechanical stability: Keeps the package intact even under thermal or mechanical stress.
Driving Innovation in Co-Packaged Optics (CPO)
Co-packaged optics are getting a lot of attention as data center traffic explodes.
By moving optical transceivers closer to switching ASICs, CPO can drop power consumption and boost bandwidth density. Here’s where engineered glass substrates shine: they let you co-fabricate electrical redistribution layers with embedded optical waveguides.
Integration Benefits
This kind of integration slashes alignment challenges, which are usually a headache and a big expense in optical packaging.
With the precision surface finish and mechanical consistency of glass, you can form optical waveguides and route electrical signals in the same substrate. That seriously streamlines manufacturing.
- Less hassle with optical alignment.
- Fewer packaging steps, which means lower assembly costs.
- Compact, multifunctional platforms, thanks to through-glass vias (TGVs).
Through-Glass Vias: A Vertical Leap Forward
Through-glass vias make it possible to create vertical electrical and optical transitions right inside the substrate.
This unlocks compact, multipurpose designs where RF components and optical pathways can sit close together without interfering with each other.
Manufacturing Considerations
Getting low-loss performance and long-term reliability with TGV technology means you have to pay close attention to manufacturing details.
Surface finish quality, via dimensional consistency, and precision waveguide formation all need tight control.
- Surface finish processes must minimize scattering and loss.
- Via formation techniques have to keep electrical behavior uniform.
- Optical pathway creation should aim for low coupling loss.
Industry Adoption and Outlook
Big names like SCHOTT, Intel, and Absolics are pouring resources into the glass-based packaging ecosystem.
After decades in semiconductor and photonics research, I can say that early prototypes already show off impressive performance. But getting to mass-market adoption will depend on nailing consistent manufacturing yields and keeping costs in check.
Challenges Ahead
Right now, the big hurdles are refining high-volume fabrication, cutting production costs, and building a solid supply chain for engineered glass substrates.
These aren’t trivial problems, but with some teamwork between material scientists, semiconductor makers, and photonic designers, they feel doable.
Conclusion: A Unified Platform for the Future
Engineered low-loss glass substrates are opening up a new path for fully integrated RF and optical systems. This could unlock big leaps in performance, which is something next-generation data centers and communication networks will absolutely need.
Widespread adoption might still be a few years off. But honestly, with all the innovation happening, it feels like a unified platform combining RF and photonics—built on engineered glass—will happen sooner or later.
If you’re a researcher, engineer, or just someone in the industry, now’s a good time to start investing in new processes, partnerships, and building up your knowledge. This shift could completely change the way we package high-performance electronics and photonics, and maybe even kick off a whole new era of speed and efficiency.
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Here is the source article for this story: Low-loss glass for RF and photonics: From Ka-band modules to co-packaged optics